Intelligent ThermalAir

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Product Introduction
Applied to thermal shock testing of electronic and non-electronic components/subsystems in communications, semiconductors, chips, sensors, microelectronics, etc., conducting adaptation testing, reliability testing, and environmental stress screening.

Key Features
● Extreme Temperature Change, Precise Temperature Control:
The equipment achieves second-level temperature shock. Based on PID algorithm, it realizes high-precision temperature control, improving efficiency by 300%.
● Targeted Thermal Flow, Isolated Testing:
Performs isolated testing on single IC components on PCB boards, avoiding interference from adjacent components, ensuring pure and refined data.
● Full-area Coverage, Platform Interconnection:
Multi-degree-of-freedom robotic arm with universal wheels enables 360° dead-angle-free mobile testing. Supports communication protocols like Modbus/RS485, achieving cross-device linkage testing.
● Energy-saving, Low-noise, Stable and Reliable:
New multiphase flow sleeve efficient heat exchange technology integrated with acoustic optimization design effectively improves refrigeration system heat exchange efficiency. Operates quietly, energy-efficiently, stably and reliably. 

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